Molex and TE Connectivity (TE) will collaborate on the launch and promotion of new connectors and cable assemblies to support the growing number of high-speed applications and enable data centers to evolve with hyperscale models and increased virtualization. The Dual Source Alliance (DSA) will support today's data speeds of 56 Gbps and above. The agreement covers next-generation connectivity products, and the alliance aims to build on its success with standard second-source agreements for products such as zSFP+, zQSFP+, CDFP, microQSFP, and Nano-Pitch I/O interconnect systems.
The DSA agreement includes self-testing: TE and Molex will conduct cross-tests of selected products and make the test reports available to customers. This will ensure product compatibility and allow customers to minimize the time required for qualification.
High-performance, high-speed connectors and cable assemblies must meet the system data requirements of new data storage equipment, servers, routers, and other applications. These connectivity products typically feature excellent high-speed electrical performance, which in turn requires sophisticated connector and cable designs with advanced features for high-speed signaling, electromagnetic interference (EMI) protection, and thermal efficiency.
