Photonics

Avicena has begun supplying customers and partners with its 1 Tb/s LightBundle evaluation kits, an optical interconnection platform based on microLEDs and aimed at developing next-generation artificial intelligence infrastructures.

ams OSRAM has developed an 850nm thin-film VCSEL platform for optical interconnects in artificial intelligence infrastructures. The company will present the technology at ECOC 2026 in Malaga, where it will also showcase a multi-core fiber solution with connectors in collaboration with BizLink.

At VISION 2026 in Stuttgart, Vision & Control will present its latest "photonics-based solutions" for industrial inspection, demonstrating how integrated vision technologies enable greater accuracy, increased process reliability, and greater production efficiency.

Vector Photonics, a pioneer in the use of photonic crystal surface emission lasers (PCSELs) in secure communications, has launched a new program that addresses a critical and growing challenge in advanced photonics manufacturing: the lack of a scalable, thermally efficient, and resource-effective encapsulation for photonic crystal surface emission lasers (PCSELs).

La Luce Cristallina today announced that the beta version of its 200 mm (8-inch) barium titanate (BaTiO₃) wafer is now available for customers to evaluate in advanced electro-optical modulators for telecommunications and data communications applications. Enabling ultra-low voltage operation, La Luce Cristallina's BaTiO₃ platform powers co-packaged optics architectures designed to meet the bandwidth and power demands of AI-scale data center infrastructures.

Taara, a graduate of Google's X, the factory for innovative projects, today announced a revolutionary approach to business communications and connectivity infrastructure, introducing Taara Photonics, the world's first wireless communication platform based on optical phased arrays, along with Taara Beam, its first product built on this photonic core.

Santec LIS Corporation, a subsidiary of the Santec Holdings group specializing in optical metrology equipment, announces the launch of its new ultra-high power tunable laser TSL-570 Type U, designed to meet the technical challenges of CPO (Co-Packaged Optics) architectures and advanced silicon photonics platforms in research, development and production environments.

Voyant Photonics, a manufacturer of photonic chips, has unveiled its Helium™ platform of solid-state LiDAR sensors and modules to enable scalable and cost-effective sensing, as well as high-resolution 4D point cloud data for the new era of Physical AI.

Research into quantum technologies is advancing rapidly and is already taking concrete steps toward devices that until recently seemed like science fiction. In this context, the Polytechnic University of Valencia (UPV) is working on the development of a reconfigurable quantum chip, a device that could transform how data is processed and protected in sectors such as communications and digital security.

Hamamatsu Photonics introduces the P16548-01AT, an optical transceiver for spatial light transmission that enables wireless optical data communication. The P16548-01AT is a compact, integrated optical transmitter and receiver that supports bidirectional, full-duplex communication at speeds up to 1.25 gigabits per second (Gbps) over spatial distances of up to 100 mm.

Researchers at Washington University in St. Louis have developed a simple and effective way to enable unidirectional light transmission in photonic chips. To improve the photonic and electronic circuits used in semiconductor chips and fiber optic systems, researchers at Washington University's McKelvey School of Engineering in St. Louis have been manipulating the physics that govern the movement of light through time and space.

Scientists from EPFL and IBM Research have developed a compact optical amplifier based on a photonic chip that far surpasses traditional optical amplifiers in both bandwidth and efficiency. This breakthrough could reshape the interconnections of data centers, AI accelerators, and high-performance computing.