The Rise of Layer C and Layer T:
In a world where cloud services are rapidly growing and high-speed connectivity is paramount, service providers must scale, simplify, and increase the flexibility of their networks. Network Functions Virtualization (NFV) provides a means to address these upper-layer network needs by migrating network functions from dedicated software devices to x86 hardware within cloud data centers. This cloud services layer supports NFV in addition to other cloud services offered (Layer C). To support Layer C, cloud data centers and end users must be interconnected by a highly scalable and flexible transport network (Layer T).
Scalable photonics are the foundation of the T layer and should provide greater capacity per line card and system while simplifying the network—fewer envelopes, fibers, and modules, and requiring less space, power, and manual processes. PICs are an integral part of the evolution of the transport network, providing significant benefits when integrated into an optical DWDM packet transport system for an efficient T layer, ultimately enabling the C layer to thrive.
Infinera's Laminated Photonic Technology for Metropolitan Networks:
Infinera's new laminated photonic technology offers a large capacity pool in a PIC that can be divided at a granular optical level, with each portion capable of being routed in a different direction as it leaves the line card or system that wraps it, typically at the hub. The recipient of the individual portion is a line card or system that matches the capacity, typically at the radio. The new ePIC-500 provides 500G of laminated capacity at the hub location, while the new oPIC-100 offers 100G of capacity at the radio location. While these two new PICs are applicable across all network locations, they were specifically developed to support Layer T in metropolitan networks.
Infinera modeled a wide range of applications, from metropolitan aggregation to long-haul regional deployments where star, mesh, or ring topologies are common. Using the new PICs, these models showed an estimated average reduction of 28 percent in modules, 31 percent in power, and 45 percent in bandwidth inefficiencies compared to conventional, commercial technologies that offer single-wavelength or super-channel solutions for 100G, 200G, or 400G.
“We found Infinera’s laminated photonics technology to be highly relevant for network architectures, and we have already tested it in our lab,” said Juan Pedro Fernández-Palacios, Senior Manager at Telefónica. “As cloud services take off, it is essential that transport networks are scalable, granular, and easy to operate. The enhanced super-channel technology with the ability to laminate is the right approach to meet these needs simultaneously.”
"Infinera continues to leverage its expertise in photonics to provide operators with tools to build optimized transport layer infrastructure," said Rick Talbot, principal analyst at Current Analysis. "We view the laminatable photonics provided by the ePIC-500 and oPIC-100 as a significant step in delivering flexible wavelength granularity for super-channels, enabling operators to lower transport costs and complexities while handling massive traffic growth."
“Infinera has been supplying PICs to transportation systems, designed from the ground up, for over a decade,” said Dave Welch, co-founder and president of Infinera. “During this time, the technology has surpassed 1.5 billion hours of field operations. Laminatable photonics allows our customers to build scalable networks and flexibility for a wide variety of applications, from metropolitan to long-haul. It provides a comprehensive toolset for us to be agile and build market-specific platforms for the T layer as our customers’ needs continue to evolve.”
Infinera's new PICs are being developed for line boards and systems that are scheduled to be available later this year.
