This development addresses the increasing data transfer needs of clusters used for training and inferring AI models. In these types of infrastructures, interconnections must manage bandwidth increases while considering factors such as energy consumption, latency, and system density.
The ams OSRAM proposal is based on addressable microemitter arrays using LED and VCSEL technologies, combined with microphotodiode arrays. These components are geared towards developing optical interconnect architectures with a high number of channels operating in parallel.
"wide-and-slow" optical architecture
that distributes data across a larger number of lower-speed optical channels instead of concentrating it on a smaller number of higher-speed channels.
This approach requires integrating transmitters and receivers with fiber optic systems, connectors, encapsulation, and other components. To achieve this, the company is collaborating with various companies in the supply chain,
including BizLink, a specialist in connectivity solutions, which is participating in the development of the demonstrator that both companies will present at ECOC 2026.
The goal of this architecture is to reduce the complexity associated with each channel and address aspects such as energy consumption, latency, and increased transmission capacity. Its application is targeted, among other areas, at internal connections within IT infrastructures dedicated to AI.
From Lighting to Optical Interconnects:
Some of the technology used in these interconnects comes from ams OSRAM's previous developments in microemitter arrays. The company has used related technologies in EVIYOS, its digital lighting platform designed for applications including adaptive automotive lighting systems.
This technology combines addressable microemitter arrays, CMOS integration, wafer-level manufacturing, and packaging techniques. ams OSRAM is adapting these elements for applications related to AI infrastructure, mobile devices, and wearables.
850nm Thin-Film MicroVCSELs:
The new platform utilizes 850nm higher-emitting thin-film VCSELs and addressable microVCSEL arrays with a 25µm pitch. It also incorporates integration via silicon vias (TSVs) and is designed to be compatible with multimode fiber infrastructures.
According to results reported by ams OSRAM, the company has integrated the microVCSELs onto silicon substrates with TSVs and demonstrated error-free NRZ transmissions at 32 Gb/s.
The company cites the energy efficiency achieved at approximately 0.25 pJ/bit. In its reliability tests, it also recorded no failures after more than 2,000 hours of operation under high junction temperatures and current overload conditions.
Building on these developments, ams OSRAM is working on 3D photonic stacks that combine microVCSEL arrays, microphotodiode arrays, and mixed-signal CMOS electronics.
