Based on HUAWEI Hisilicon chipset technology, the new modules offer features specifically designed for M2M communication. SILICA provides in-depth technical support and is offering after-sales software support for HUAWEI modules for its ArchiTech evaluation boards, accelerating and facilitating product development. The boards also feature mini PCIe connectors and SIM card support.
M2M and Internet of Things (IoT) communications applications demand low power consumption and highly reliable wireless links. When using cellular radio networks, certified products that support multiple standards are preferred by operators, enabling network upgrades and minimizing inventory if the same products are used in more than one country. HUAWEI modules support over 90% of operators worldwide.
Although lower data rates may be adequate for many current M2M applications, 3G (HSPA/HSPA+) is becoming the dominant standard, and 4G (LTE/LTE-A) networks are expanding rapidly. As a result, designers need to specify 3G or dual-standard 3G/4G modules to ensure products have a long lifespan.
