The patented FireFly™ Micro Flyover System™ is the first future-proof interconnect system that gives designers the option of using either optical or copper interconnects, with the same micro footprint to meet current and future data rate requirements. Data connections at 28+ Gbps bypass the board and other components, thus simplifying board design and improving signal integrity.
FireFly™ features a secure, board-hardened connection with customizable profiles as small as 8.12 mm, an integrated heatsink, and multimode fiber optic cable that exceeds Telcordia GR-468 (300 G). This Micro Flyover System™ optimizes signal integrity, providing the potential for higher data rates and longer cable lengths, which aids in full system channel support, streamlining, and signal path optimization—from the IC to the board, anywhere in between, and beyond.

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