Samtec designs, develops, and supports all levels of interconnection and all points in between high-speed connectors and cable assemblies. This guide provides an overview of board-level patch strips, high-density arrays, high-speed board systems, high-speed coaxial and twinax cable assemblies, high-speed I/O systems, RF, active optical cable assemblies (including QSFP+ and PCI Express®), onboard optical engines, paddleboards, and silicon integration solutions, including stacked dies, MCMs, COBs, flip chips, wirebonding, and die attach, among others.
SI Fusion's features are offered with full engineering support, signal integrity, design and prototype construction, from initial concept to final production.
The recent addition of Samtec Microelectronics Group (formerly Aspen Technologies) and Samtec Optical Group (formerly AlpenIO) further expands Samtec's capabilities to include active optics and integrated silicon-silicon solutions.
