Revolutionizing AI computing with Jetson Orin NX/Nano SOMs in a compact system.
The iEP-6010E series supports various configurations, including the iEP-6010E based on the NVIDIA® Jetson Orin NX SOM with 16 GB of 128-bit LPDDR5 memory, the iEP-6011E based on the NVIDIA® Jetson Orin NX SOM with 8 GB of 128-bit LPDDR5 memory, the iEP-6012E based on the NVIDIA® Jetson Orin Nano SOM with 8 GB of 128-bit LPDDR5 memory, and the iEP-6013E based on the NVIDIA® Jetson Orin Nano SOM with 4 GB of 64-bit LPDDR5 memory. The 16GB NVIDIA® Jetson Orin NX SOM boosts performance to up to 100 SPARSE (50 DENSE) INT8 TOPS and nearly 5x the throughput compared to the previous NVIDIA® Jetson Xavier™ NX SOM.
Range selections come in compact packages measuring 55 x 170 x 134mm for the Basic SKU and 68 x 170 x 134mm (W x H x D) for the PoE/5G SKU. With the Jetson Orin NX or Orin Nano SOM, the iEP-6010E series enhances the AI processing capabilities of embedded computing devices and peripherals that demand higher performance but are limited by size, weight, and power consumption.
The iEP-6010E series offers flexible I/O for Edge AI applications.
The iEP-6010E series simplifies the deployment of Edge AI video solutions with its extensive I/O flexibility. The series features two USB 3.2 Gen 2x1 ports (one with a locking function), two USB 2.0 ports, and two Gigabit LAN ports in the base model, or a PoE model with up to two IEEE 802.3AF PoE ports for deploying cameras with power and video transmission. There is one HDMI 2.0 port for models with an Orin NX SOM and one HDMI 1.4 port for models with an Orin Nano SOM, one RS-232 port, one RS-232/422/485 serial port, as well as proprietary inputs and outputs: a custom-designed DB15 connector that incorporates signals for power/GND and a remote power/reset button. The other proprietary DB15 connector includes I2C, SPI, CANBUS interface, and power/GND pins, designed for embedded applications. Additionally, the series' storage support includes an M.2 Key M (2280) slot for PCIe Gen 4x4 in the iEP-6010E/iEP-6011E and Gen 3x4 in the iEP-6012E/iEP-6013E for NVMe SSD storage at higher speeds, with a Micro SD card slot also available.
Advanced RF capabilities and rugged design.
The iEP-6010E series supports various expansions to enhance wireless communications and advanced RF connectivity, including an M.2 Key B (3042/3052) socket for optional 5G modules or a 4G LTE module in 5G SKUs. An M.2 Key E (2230) socket for optional Wi-Fi modules is also available for all SKUs. RF capabilities are implemented through up to four 5G/4G LTE antennas and two Wi-Fi antennas for 5G SKUs, configured for excellent communications. With its robust design, the iEP-6010E series supports a wide operating temperature range of -25°C to 60°C and a wide DC input voltage range of 12V to 36V, with 80V surge protection, OVP, UVP, OCP, and reverse polarity protection. It also features a Phoenix-type connector, or PD3.0 20V USB Type-C power adapter interface with a locking mechanism, allowing users to utilize the battery bank for mobile device use cases. Additionally, it can serve as a backup DC input when the Phoenix-type DC IN output falls within the 21V–36V range. The internal carrier also includes two dual-lane MIPI-CSI2 interfaces for image capture.
“With the growing variety and inspiration in Edge AI applications, ASRock Industrial is excited to expand our new product line, powered by the NVIDIA® Jetson platform, with the introduction of the iEP-6010E series.” James Lee, president of ASRock Industrial, stated, “This launch demonstrates our commitment to meeting the growing needs of AI applications worldwide. The series offers increased speed and energy efficiency, versatile I/O options, and advanced RF features that will stimulate the development of new applications at the AI Edge.”.
