Designed for 25 Gbps serial communications over Ethernet and high-speed Fibre Channel, the new zSFP+ interconnect systems are scalable for the next generation of applications and provide excellent electromagnetic interference (EMI) and signal integrity (SI) characteristics on 10 and 16 Gbps channels.
The zSFP+ connectors are backward compatible and have the same mating interface and EMI-shielded housing with the same dimensions as the SFP+ form factor. The zSFP+ connectors feature a preferential mating design with insert molding and a precisely shaped, minimal-thickness mating geometry that optimizes mechanical and electrical performance and signal integrity, while significantly reducing resonance compared to current SFP+ products. Components of the new zSFP+ interconnect system include 20-circuit zSFP+ SMT connectors, stacked integrated connectors, and passive optical cable assemblies.
Regarding PCB footprint, mating interface, and EMI-shielded enclosure size, the 20-pin zSFP+ SMT connectors are identical to SFP+ host board designs, making them fully backward compatible and ready for immediate replacement. The high-temperature resistant thermoplastic enclosure is suitable for lead-free soldering. Single-port clustered enclosures support multiport applications and options with varying board thicknesses and assembly processes, enabling the integration of server and switch applications at a cost comparable to SFP+ enclosures. Two-, four-, or six-port clustered enclosures are available for multiple design options.
Stacked integrated connectors and housings are available in a snap-on system, eliminating reflow soldering and offering a compact, space-saving, and easy-to-process design. Internal vertical shielding greatly reduces electromagnetic interference. Snap-on terminations allow for close-fit (belly-to-belly) mounting of individual and grouped housings to maximize PCB space utilization. Optional back or side LED tube covers provide flexibility in routing the LED PCB signal to inform the user about port status and activity.
Molex OM3/OM4 fiber optic duplex LC cable assemblies are used in combination with zSFP+ optical modules to provide a high-performance interconnect solution with customized options, including different lengths and cable clamps for straight and 45- and 90-degree angled cables. The OM3/OM4 fiber duplex LC patch cables offer the enhanced launch bandwidth required for this new generation of zSFP+ devices. Molex duplex LC connectors comply with EIA-TIA and FOCIS 10 standards and are compatible with MSDA devices.
