In today's fast-paced world, solutions for integrating optics with electronic circuitry, also known as co-packaged optics (CPO), are in high demand. These solutions enhance optical performance, increase bandwidth, and reduce power consumption. “The CudoForm team is excited to join forces with SENKO,” said Dr. Ryan Vallance, CEO of CudoForm. “We recognize the importance of reliable, high-precision connectivity for CPO, and by combining CudoForm and SENKO, we bring together complementary technology platforms to deliver innovative solutions that meet the demanding requirements of this space-constrained and challenging photonics ecosystem.”

CudoForm can make this possible thanks to its expertise in high-precision stamping of metal components, such as optical connectors. Combined with its extensive years of research and development, this acquisition will firmly position Senko Advanced Components, Inc. at the heart of the emerging and rapidly growing optical communications market, particularly in the field of photonic integrated circuits or PIC interconnects. Furthermore, the expertise in precise beamforming and directionality will generate new opportunities in high-growth areas beyond the primary focus of data center switch interconnects, such as 3D/VR imaging, LIDAR, healthcare and digital sensing, and solid-state and UVC LED lighting for pathogen reduction.

“We are very pleased with this acquisition, especially since CudoForm is a global leader in optical interconnectivity. By combining their research and innovative solutions with our expertise, we will be able to enhance our product development and further strengthen our market position. Both organizations share a common mission to deliver peak performance and innovation to our customers. We look forward to offering the combined synergies of two industry-leading companies to our customers,” commented Kazu Takano, President of Senko Advanced Components, Inc.