This ebook explores the importance of signal integrity in RF and high-frequency designs and provides solutions to meet the growing demands of modern electronics, especially in mission-critical fields such as medicine and automotive. The ebook highlights many of the products offered by both ADI and Samtec, enabling customers to leverage the design expertise of both companies. This allows them to easily achieve high signal integrity and meet their system design requirements with appropriate specifications, margin, and reliability.
The ADI ADF4368 microwave broadband synthesizers offer clean, ultra-low jitter frequency synthesis from 800 MHz to 12.8 GHz. The need for subharmonic filters is eliminated because an internal doubler is not required, simplifying the design and reducing bill of materials costs.
The ADI ADL8112 low-noise amplifier (LNA), available upon request, provides wideband operation from 10 MHz to 26.5 GHz. The integration of an amplifier and two single-pole, four-position reflective switches (SP4T) allows for multiple routing paths through the device. With integrated power supply decoupling capacitors, minimal decoupling from the external power supply is required.
The ADI ADPA7009-2 GaAs pHEMT MMIC power amplifier provides 17.5 dB of gain, an output power for 1 dB compression (OP1dB) of 28 dBm, and a typical output third-order intercept (OIP3) of 34.5 dBm between 20 and 35 GHz. The RF input and outputs are internally matched and DC-locked for easy integration into higher-level assemblies. Most of the external passive components typically required for operation are integrated, allowing for a small and compact printed circuit board (PCB) footprint.
Samtec AcceleRate® HD ultra-dense mid-strips are super-dense micro-interconnects with up to 240 input/output (I/O) pins. These connectors are PCIe® Gen 5 compliant, support 56 Gbps PAM4 applications (28 Gbps NRZ), and feature an Edge Velocity® contact system optimized for signal integrity performance.
SEARAY™ SEAF and SEAM connectors are high-density, open-pin field arrays. The open-pin design allows customers to simultaneously run differential pairs, single-ended signals, and power over the same interconnect at speeds exceeding 28 Gbps. SEARAY's connection region is simplified by utilizing Samtec's patented Differential Vias™ technology. This method enables wider routing channels with a 2:1 ground-to-via ratio, improves signal integrity at high data rates, and reduces overall cost.
The HSEC8-RA high-speed edge card connectors feature Samtec's robust Edge Rate contact system and are designed to ensure signal integrity and multiple mating cycles. These connectors offer superior impedance control, reduced side coupling (crosstalk), and a 1.2 mm contact distance.
Aire promotes the creation of MVNOs with its "turnkey" solution for companies
Aire (formerly Grupo Aire) consolidates its "turnkey" model that eliminates barriers to entry so that companies can become Mobile Virtual Network Operators (MVNOs) in an agile, simple way and without the need for their own infrastructure or technical knowledge.
