The Impel connection system offers industry-leading performance in crosstalk and density, with data rates up to 40 Gbps for next-generation backplane interconnect solutions. Meeting all critical architectural requirements, including conventional, coplanar, and orthogonal connections for both direct and midplane applications, it is ideal for telecommunications and data networks.
The conventional Impel connector, with a rectangular daughterboard coupled to a vertical printhead, offers 2- to 6-pair options for cost-effective performance increases. The standard 1.90 mm solution supports 80 differential pairs per linear inch, while the 3 mm solution enables quad-via capabilities and fewer PCB layers. Without changing the configuration, the Impel connection system allows for coplanar solutions supporting rectangular daughterboard-to-printhead connections, providing greater system flexibility. Backplane Impel solutions for orthogonal architectures support 3- to 6-pair configurations, expanding from 18 to 72 differential pairs per node. Incorporating a third-generation design, the Impel connection system also offers direct PCB connections in an orthogonal orientation to reduce system channel lengths, improve signal integrity, support open airflow designs, and reduce costs.
To help customers select precisely the products they need, Molex offers the Backplane Pin Map Configurator. Available free of charge on the Molex website, the tool guides users through a series of inputs to identify backplane parameters and quickly generate a pin map for their own backplane application. This reduces lead times, simplifies design, and increases the overall performance of backplane systems.
