To meet the growing demand for next-generation servers, storage equipment, and data networks, Molex Incorporated has added the new Impact 85 Ohm to its Impact™ backplane connection product family.The new Molex Impact 85 Ohm connector system is designed to meet Intel®'s QPI (Quick Path Interconnect) architecture, as well as to enable PCI Express Generation 2.0 and 3.0, and any specific system design where an 85 Ω differential impedance is desired
To offer designers the flexibility to interchange 100W and 85W signal modules depending on system requirements, Molex has designed both connection systems with identical physical size, density, spacing, and printed circuit board format, as well as using the same routing and power solutions. Therefore, to avoid confusion between the Impact 85 Ohm and the 100W lines, the Impact 85 Ohm is offered in a light gray LCP (Light Color Pack). This allows designers to visually identify their designs with a color code.
The Impact 85 Ohm also utilizes existing interface designs that conform to the Impact 100 Ohm connectors, so designers avoid wasting time and money requalifying critical system components. These proven designs offer excellent electrical and mechanical performance compared to other backplane connectors currently available on the market.
Molex continues to expand its Impact backplane connector family. Currently, they offer traditional 2, 3, 4, 5, and 6-pair backplane header and daughter card connectors that support differential signal densities from 27 to 80 pairs per linear inch, along with a full range of high-performance cabling solutions, including guide, power, coplanar, and mezzanine cables.
