The device features fast rise/fall times, enabling high-speed operation in the tens of MHz range, and incorporates integral micro-optics to efficiently couple light into multimode glass optical fibers as small as 50 µm, achieving a typical launch power of 30 µW at 100 mA across 50/125 fibers.
 
Many fiber optic emitters utilize a clear plastic cap that presses onto the device head. While this provides a physical element of protection for the LED chip, wire splicing, and internal optics, it is unusual for such a cap to provide a hermetic seal. This means that the potential long-term effects of environmental factors such as internal humidity on the device must be carefully considered in applications where extended lifespan is critical. In contrast, the hermetically sealed housing of the FDE851HLBF eliminates this variable, as air from the operating environment cannot reach the internal components.
Also being showcased for the first time is another addition to the company's transmitter lineup: the FDE2850 emitter, a high-power, high-speed fiber optic transmitter optimized for 200 µm glass fiber systems. The company can produce it with lead times significantly shorter than typical industry standards for this type of device.
 
The company will also be exhibiting its H19 Fiber Optic Shield, an Arduino Uno-compatible microprocessor shield designed to enable easy evaluation and integration of fiber optics into microprocessor-based designs.

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