“We are pleased to have reached an agreement with Samtec that allows us to introduce OEMs to a new, reliable, and expert supplier in the current connector market, including its niches,” said Ken Stead, product manager at Molex, adding: “Recognized for its high capabilities in the industry, Samtec is an ideal multi-vendor marketing partner to expand the overall market for these innovative Molex solutions.”.
The Molex Edgeline range comprises four dynamic product families (CoEdge, Vertical, Press-fit CoPlanar, and EdgeLine Signal & Power), each with unique features and advantages. These one-piece edge card connectors offer a cost-effective, flexible, and scalable interconnect solution with numerous mating orientations for a wide range of telecommunications, computing, and storage systems.
The Molex EXTreme LPHPower, a high-current power and signal combination connector, delivers up to 127 A per linear inch of space and can be mated in a rectangular, coplanar, or vertical orientation. The low-profile (7.50 mm/0.295”) EXTreme LPHPower interconnect can increase airflow by 25% compared to standard SSI connectors. The
Molex EXTreme Ten60Power connector is a high-current power and signal system with a coplanar or rectangular board-to-board orientation. The EXTreme Ten60Power connector delivers up to 260 A per linear inch, representing the highest current density of any low-profile connector on the market.
“At Samtec, we are excited to have entered into a licensing agreement with Molex to offer our customers their proven, patented solutions. As pioneers in the electronics market, our collaboration will make a difference in current and future markets thanks to these cutting-edge connectivity technologies,” said Doug Wathen, Director of Product Marketing at Samtec, Inc.
Samtec's new offerings will include Molex's Edgeline, EXTreme LPHPower, and EXTreme Ten60Power products. The two companies intend to jointly conduct cross-testing to obtain certifications of conformity to UL and CAT safety standards.
