To meet the explosive growth of video- and mobile-driven data traffic, internet content providers such as Amazon, Microsoft, Google, and Facebook are building hyperscale data centers, which require high-speed interconnect solutions that are energy-efficient, compact, and cost-optimized. MACOM's Etched Facet Technology (EFT) lasers are bonded to a silicon PIC using its proprietary Self-Alignment Technology (SAEFT™) process with high coupling efficiency, offering an energy-efficient solution at a reduced manufacturing cost.
 
The MACOM MAOP-L284CN features four high-bandwidth Mach-Zehnder modulators, integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at speeds up to 28 Gb/s. The L-PIC™ operates on standard single-mode optical fiber and includes integrated shunt detectors for fiber alignment, system initialization, and closed-loop control. A single fiber aligned with this component's 4.1 x 6.5 mm output coupler is the only optical requirement for using this device in QSFP28 transceiver applications. MACOM is also offering the integrated MASC-37053A modulator controller with CDR, paired with this L-PIC™ for optimized performance and power dissipation.
 
“Silicon photonic integrated circuits, or PICs, enable the integration of optical devices such as modulators and multiplexers onto a single chip. We believe MACOM’s L-PIC™ solves the key challenge of laser alignment for the silicon PIC, delivering high performance and high coupling efficiency, making the adoption of silicon PICs a reality for high-speed optical interconnects in the data center,” said Vivek Rajgarhia, Vice President of Strategy for High-Speed ​​Networks at MACOM.
 
MACOM’s L-PIC™ will be showcased at OFC 2016, Booth #3101, March 22–24 in Anaheim, CA.

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