Vertiv MegaMod HDX integrates direct-to-chip liquid cooling with air-cooled architectures to meet the intense thermal demands of AI workloads, supporting pod-like AI environments and advanced GPU clusters. The new compact solution features a standard module height and a maximum of 13 racks, with a power capacity of up to 1.25 MW; the combined solution features an extended-height design and, with a maximum of 144 racks, supports power capacities of up to 10 MW. Both can support rack densities from 50 kW to over 100 kW per rack. The hybrid cooling architectures integrate direct-to-chip liquid cooling with air cooling for efficient, high-density thermal management, while the prefabricated modular designs enable rapid deployment and allow customers to scale their data centers as demand grows.

“Today’s AI workloads demand cooling solutions that go beyond traditional approaches. With Vertiv MegaMod HDX available in both compact and combined solution configurations, organizations can tailor their facility requirements while supporting high-density environments at scale with liquid cooling. Our designs deliver what data centers need most: reliable operation, operational efficiency, and the ability to scale AI infrastructure with confidence,” said Viktor Petik, senior vice president of infrastructure solutions at Vertiv.

vertiv megamon liquid cooling CPD 2w

The Vertiv™ MegaMod™ HDX models incorporate an innovative hybrid cooling architecture, combining direct-to-chip liquid cooling with adaptive air cooling systems in a fully integrated, pre-built pod. The solutions feature a distributed redundant power architecture that enables continuous operation even if a module fails. Furthermore, the thermal backup system using an inertia tank allows GPU clusters to maintain stable operation during maintenance or load transitions. This factory-integrated design enables replicable deployment accuracy while providing cost certainty for AI infrastructure planning and scaling.

This prefabricated design, combined with factory-integrated and fully tested components and Vertiv’s global service network, provides reliable end-to-end support. Vertiv’s broad portfolio of power, thermal, and IT management solutions supports a wide range of data center architectures, enabling customers to meet increasing density demands with a scalable, high-performance infrastructure. Both configurations are supported by this broader portfolio, which includes the Vertiv™ Liebert® APM2 uninterruptible power supply (UPS), the Vertiv™ CoolChip CDU coolant distribution unit, the Vertiv™ PowerBar busbar system, and the Vertiv™ Unify infrastructure monitoring solution.

Vertiv also offers IT rack infrastructure designed to continuously house and support IT systems, including Vertiv™ Racks and OCP-compatible Vertiv™ Racks, the Vertiv™ CoolLoop RDHx Rear Door Heat Exchanger, the Vertiv™ CoolChip Rack CDU, Vertiv™ Rack Power Distribution Units, the Vertiv™ PowerDirect Rack DC Power System, and Vertiv™ CoolChip Rack Fluid Network Manifolds.

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