Generative AI places unique storage demands, including the need to store massive datasets to train large linguistic models (LLMs) and create embedding and vector databases that support inference through recovery augmented generation (RAG).
These workloads require storage solutions with higher capacity, speed, and exceptional efficiency. Featuring a 32-chip stack of 2-terabit (Tb) BiCS FLASH™ QLC 3D flash memory[3] with innovative CBA (CMOS directly bonded to the die) technology, KIOXIA's LC9 Series SSDs deliver the speed, scale, and density required to handle the next wave of data-centric workloads. This combination of advanced memory architecture and CBA technology enables an 8 TB BGA package in a small 154-inch form factor, also an industry first[1]. This milestone was made possible by KIOXIA's advanced wafer processing, materials design, and high-precision wire bonding technologies.

KIOXIA's LC9 Series SSDs are ideal for data lakes, where massive data ingestion and rapid processing are essential. Unlike hard drives, which often bottleneck performance and leave expensive GPUs underutilized, KIOXIA's LC9 Series SSDs enable dense storage in a compact footprint with higher capacity per watt. Providing up to 245.76 TB, each drive can replace multiple power-hungry hard drives, delivering superior performance, lower overall power consumption, fewer drive slots used, and more efficient cooling, significantly reducing the total cost of ownership (TCO).


Features of KIOXIA's LC9 Series SSDs include:
● Up to 245.76 TB in 2.5-inch and E3.L form factors
● Up to 122.88 TB available in 2.5-inch and E3.S form factors
● Designed to meet PCIe 5.0 specifications (max. 128 GT/s Gen5 single x4, dual x2), NVMe 2.0, NVMe-MI 1.2c
● Support for the Open Compute Project NVMe Datacenter SSD v2.5 specification (not all requirements met)
● Support for Flexible Data Placement (FDP) to minimize write amplification and extend SSD lifespan[4]
● Security options: SIE, SED, FIPS SED
● CNSA 2.0 signature algorithm[5], designed with future quantum security standards in mind

“We continue to drive innovation with the new KIOXIA LC9 series, which delivers cutting-edge technology that enables our data center and hyperscaler customers to stay ahead of the curve,” said Paul Rowan, Vice President and CMO of KIOXIA Europe GmbH. “The 2-terabit (Tb) BiCS FLASH™ QLC 3D 32-chip stack, combined with our innovative CBA technology and the E3.L form factor of the LC9 series SSDs, meets the unique speed, scale, and efficiency requirements of generative AI applications.”