The 1.27 mm pitch EMM interconnects reduce space by 40% compared to their CMM series and by 20% compared to standard Micro D connectors. One recent customer application was a sophisticated missile drive system; others include the motherboard for the TUM Hyperloop capsule.

With a 1.27 mm pitch in configurations from 4 to 60 pins, the EMM series is highly modular, suitable for both board-to-board (thanks to its safe sweep length) and board-to-wire (24 to 30 AWG) configurations, with straight and 90° through-hole and SMT male and female variants, as well as wired versions. The 90° EMM series interconnects feature ingenious integrated back shielding, with the contacts protected by a proprietary design. The hardware is interchangeable, with locking and guiding functions available on both male and female connectors to ensure that misalignment and mis-mapping do not occur.

Manufactured at Nicomatic's facilities in France, the EMM series connectors feature a high-performance fiberglass composite molding, copper alloy male pins and pin-technology female pins, and a 4-finger spring-contact clip made with a copper alloy exterior and beryllium copper interior. The mounting hardware is made of passivated 300 series stainless steel. EMM interconnects can be coupled and uncoupled up to 500 times.

The electrical performance is outstanding: the rated voltage is 250 V RMS at sea level, and the dielectric withstand voltage is 750 V RMS. At high altitudes, where the EMM series is often specified, the dielectric withstand voltage is 540 V RMS at 30,000 feet (9,000 meters) and 465 V RMS at over 100,000 feet (30,000 meters).

For extreme environments, the EMM series is qualified to withstand vibration, shock, extreme temperature cycling, fluid immersion, humidity, and salt spray corrosion. For space applications, they are certified to meet the ASTM E595 (ECSS-Q-ST-70-02C) specification for thermal vacuum degassing.

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