An additional challenge in these types of wireless applications is to provide a high interconnect specification to fit on a board with very limited space – in the case of antenna interconnects, the available space is only 0.3 mm x 1.0 mm and a working height of 0.9 mm.

To address all these constraints and provide an optimal solution for manufacturers, ITT ICS designers have created this wireless interconnect. With a 300k psi domed contact, the interconnect has a minimum force of 0.5N and a deflection of 0.60mm, maintaining signal integrity through the antenna. Its reduced length allows it to fit into tight spaces, yet it withstands manufacturing stresses and remains stable on the board. Available in copper-beryllium or copper-titanium, it also features sidewalls that provide exceptional mechanical strength, ensuring good soldering and preventing burrs.

The new wireless interconnect in SIM cards, speaker/vibrator, microphone, battery or board-to-board contact in numerous wireless portable applications, including mobile phones, PDAs, laptops, memory cards, CT scanning equipment and GPS units.

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