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Molex Incorporated and Neoconix have developed a high-density, high-speed, flexible copper “interposer” in a tool-less, easy-to-use configuration.Now available, Molex's FlexBeam™ interposer is a low-profile flex-to-board interface that delivers densities of 1 mm (0.039 in) or less across a variety of pin array configurations.
Combining Molex's high-speed, flexible copper assembly with Neoconix's HD&S PCBeam™ interposer provides a high-density, high-speed interface for flexible PCB applications.
The FlexBeam™ copper interposer is used in servers, mass storage devices, medical imaging systems, automated testing equipment, and military command and control centers. It features durable, all-metal, flat springs embedded in an FR-4 substrate, adding a third dimension (z-axis) to traditional two-dimensional PCB processing in a high-density configuration.
Its photolithographic, edge-based manufacturing process allows for superior dimensional control compared to traditional stamping and molding. Furthermore, the process is scalable for very compact form factors in space-constrained applications. Typical configurations include true mechanical conformance of 0.152 mm (0.006 in) on each side with 1.00 mm (0.039 in) spacing to ensure high reliability. The innovative Dual Beam option is also available to provide contact redundancy in high-reliability applications.
The flexible copper assembly combined with the PCBeam interposer enables differential signal rates exceeding 10 Gbps and single-terminate signal rates of 4 GHz and above, with less than 3% crosstalk in a pin matrix configuration. In addition, the flexible copper assembly provides a contact configuration that allows for a board-to-flex number of I/O pins of 500 or more.
