The latest additions to Samtec’s SEARAY family are a right-angle design ideal for high-speed micro backplane applications and a Press-Fit design, which combines the flexibility and convenience of press-fit terminals with superior signal integrity and mechanical performance. Both designs utilize a 1.27 mm x 1.27 mm (0.050” x 0.050”) grid-array configuration to achieve maximum grounding and routing flexibility and the robustness characteristic of Samtec’s Edge Rate™ optimized signal integrity contact system.

 


SEARAY right-angle male and female connectors (SEAM-RA/SEAF-RA series) have been optimized to reduce impedance mismatch and have low insertion and extraction forces. They are available in 4, 6, 8, or 10-row configurations with up to 500 I/O.


SEARAY™ Press-fit terminals (SEAMP series) are available in 4, 6, 8, or 10-row configurations, offering up to 500 I/O. The terminals mate with a selection of SEARAY interfaces: surface-mount female connectors (SEAF series) in three standard heights, high-density Flex Data Links (SADL series) for wire-to-board applications, or the new right-angle connectors (SEAF-RA series) for multi-layer PCB designs, such as high-speed micro backplane applications.


Samtec has also recently introduced a new 0.8 mm (0.0315”) micro-pitch version of its SEARAY high-density interconnect connectors (SEAM8/SEAF8 series) that delivers unprecedented high-speed performance and flexibility with a 50% board space saving.

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