Undetected pressure variations in bonding processes can lead to poor or non-existent connections in flip-chip assemblies, reducing long-term performance and reliability, as well as increasing costs. Maintaining a constant pressure distribution in the flip-chip bonding process ensures coplanarity, optimal compression, and controlled gap elimination. The Pressurex® pressure-indicating sensor is a valuable tool for current bonding tools used in flip-chip connections, as these tools lack the ability to measure pressure variations and instead assume a uniformly distributed pressure.
Pressurex® is a proven measurement tool for sheet-to-sheet bonding, offering low-cost control of coplanarity and bond uniformity in flip-chip connections.
The Pressurex® pressure indicator is a convenient, accurate, and economical tool for monitoring coplanarity and bond strength. The thin, flexible film sensor can detect pressures ranging from 2 to 43,200 psi (0.14 to 3,000 kg/cm²). To take a measurement, the sensor is placed between the bonding surfaces, changing color instantly, permanently, and directly proportionally to the amount of pressure applied. Determining the magnitude and distribution of pressure is easy by comparing the measured color to a color correlation chart. (This concept is the same as that used in interpreting litmus paper.)

For more information or a free sample of Pressurex® film, please contact Sensor Products Inc.

Established in 1990 in New Jersey, Sensor Products Inc. is a global leader in the manufacture and distribution of tactile pressure measurement solutions. Its customized and unique products are installed in all Fortune 500 industrial companies and thousands of smaller manufacturers. Its sensors have diverse applications, ranging from tire testing and semiconductor manufacturing to space mission R&D laboratories. In addition, Sensor Products provides pressure and stress analysis maps and offers a variety of technical seminars in different regions

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