PowerStrip ™ sockets and terminal blocks (UPS/UPT series) are available in vertical or right-angle orientations for coplanar and perpendicular mounting on the faceplate, with standard heights of 7 or 10 mm. The 3.81 mm (0.150 in) pitch system can be configured with 2, 4, 6, or 8 power terminals and offers a typical current-carrying capacity of 21 A per contact (specified at 80°C with four gold-plated contacts under power). A locking clip is available as an option for applications requiring greater stability and mechanical strength. Samtec's PowerStrip product line also includes systems with current-carrying capacities of 25 A and 35 A per contact (depending on temperature and the number of powered contacts). The PowerStrip ™ /25 connectors with a 5 mm (0.197 in) pitch include power and power/signal combinations, an articulated design for 90° mating, and a discrete wire cable system. The PowerStrip ™ /35 connectors with a 6.35 mm (0.250 in) pitch are available in power or power/signal combinations.
Han® Q 4/0 and Han® Q 3/0 power connectors in the semiconductor industry
In the semiconductor industry, microchips are manufactured from what are known as wafers, which are composed of a high-purity crystalline material such as silicon. The wafers are initially polished and cleaned before undergoing various surface treatments, including oxidation and CVD.
