The series is available in M.2 and PCIe form factors, offering high-performance, low-latency connectivity with support for DPDK, PTP, and SR-IOV, enabling efficient processing of data-intensive workloads in space-constrained environments.
With the accelerating adoption of Edge AI, traditional 1GbE connectivity is no longer sufficient to support real-time data processing, high-resolution video transmission, and the integration of multiple sensors. Innodisk's 10GbE LAN series addresses these challenges with low-latency connectivity powered by Intel E610/X710 Ethernet controllers and support for DPDK 25.07/DPDK 16.11, PTP, and SR-IOV, accelerating packet processing, ensuring time synchronization, and improving resource utilization in virtualized environments. This enables consistent, high-performance network connectivity for Edge AI applications, including AI inference, AGV and AMR coordination, vision systems for smart factories, and NVR surveillance.
The series is available in M.2 2242, M.2 2280, and low-profile PCIe form factors, facilitating integration into a wide variety of embedded systems without requiring major redesigns. Its daughterboard architecture, along with high-speed shielded cables, enables flexible installation and upgrades in space-constrained environments, reducing integration complexity and accelerating time to market.
Some models also offer support for operation in wide temperature ranges from -40°C to 85°C, ensuring stable performance in demanding conditions such as outdoor deployments and industrial automation.
Industry-first innovations in M.2 form factor:
Innodisk pushes the boundaries of M.2 networking with several industry-leading designs. Its EGPL-T203, a dual-port 10GbE LAN module with wide temperature range support, is the first of its kind in the M.2 form factor certified to operate between -40°C and 85°C Ta, enabling reliable deployments in harsh environments. The series also includes the EGPL-T2F1, the first M.2-based LAN module with an SFP+ interface, recognized with the Embedded World 2026 Best in Show Award, compatible with both optical SFP+ modules and direct-attached copper (DAC) cables for high-speed fiber connectivity.
