Samtec's COM-HPC interconnect solutions, available through Mouser, are based on Samtec's high-performance AcceleRate® HP arrays, offering design engineers enhanced scalability and performance for embedded system design and interface flexibility. Equipped with paired 400-pin connectors (800 pins total), COM-HPC systems deliver 32 Gbps per channel, 2088 Gbps per square inch, and a maximum cumulative throughput of 4096 Gbps up to 300 W (from 11.4 V to 12.6 V), and are compatible with current and future interfaces, including PCIe 5.0 (32 GT/s) and 100 Gb Ethernet.
Ideal for server and client modules, medical applications, data communication, telecommunications, IoT and other high-speed and high-cycle applications, COM-HPC interconnect solutions are available in stack heights of 5 and 10 mm and a pitch of 0.635 mm.
