SlimStack B8 SMT compact board-to-board connectors, with a pitch of 0.40 mm, a height of 0.80 mm and an ultra-narrow width of 2.50 mm, provide huge space savings in mobile devices, data transmission and telecommunications systems, consumer electronics and high-end medical equipment.
“In the flex-to-board bridge connector manufacturing process, solder residue or dust can settle on the contacts and interrupt signal continuity. As mobile devices increase in value and complexity, OEMs need reliable and secure power connections to avoid costly repairs or replacements,” says Mike Higashikawa, product manager at Molex, adding, “All the features built into the SlimStack B8 connection system have been designed and developed to deliver maximum reliability in mobile devices.”
Building on the undeniable advantages of Molex's SlimStack range, the SlimStack B8 features a new, patent-pending contact design called CleanPoint. This beveled contact provides a wider, more uniform cleaning path and a more stable signal than other connectors for mobile applications. The CleanPoint contact and redundant dual-contact terminal ensure a secure, drop-proof, shock-resistant connection that withstands rough handling.
The SlimStack B8's mounting method includes a robust metal top cover design for the housing, which effectively protects the terminal from damage resulting from forced disconnections at an angle (zippering). The metal cover protects the housing from damage during blind connection maneuvers or disconnections at an angle. Connection tests performed on the outer wall of SlimStack B8 connectors demonstrate that the housing remains undamaged under applied forces of up to 50 N and displacements of 0.80 mm. Excellent mechanical characteristics, such as a perceptible click upon connection and high clamping force for a more stable contact, ensure ease of use.
