Other coupling mechanisms are also under development, including a vertically coupled, detachable fiber-to-PIC (photonic integrated circuit) solution, demonstrating the combined capabilities of GlobalFoundries and Corning to produce multiple forms of co-packaged PIC-to-fiber connectivity.

The collaboration leverages Corning’s innovation in glass, fiber optic, and connectivity technologies. This includes a broad portfolio of specialty glass compositions, glass wafers, IOX and laser processing, and fiber array units (FAUs), which utilize fibers with ultra-precise core alignments that minimize insertion loss for the most demanding data centers and high-performance computing applications.

Built on GF’s comprehensive silicon photonics platform, which supports co-packaged optical solutions for scalable and expandable networks, this collaboration will combine Corning’s established supply chain and leadership in optical interconnect technologies with GF’s high-volume manufacturing capabilities and leadership in silicon photonics.

“Our collaboration with Corning represents a significant step forward in delivering next-generation connectivity solutions for AI and machine learning,” said Kevin Soukup, senior vice president of GF’s silicon photonics product line. “Corning’s cutting-edge fiber technology, integrated with our proven silicon platform, delivers the performance and flexibility needed to enable scalable, high-density optical packaging for AI data centers.”

“Our collaboration with GlobalFoundries is helping to shape the future of AI infrastructure and accelerate the progress needed to meet the demands of an increasingly data-driven world,” said Dr. Claudio Mazzali, vice president of global research at Corning. “The combination of GlobalFoundries and Corning’s expertise in silicon processes and optical connectivity has tremendous potential: together, we are unlocking new possibilities for the AI-driven industries of the future.”