Teraspeed® Consulting offers silicon-to-silicon signal integrity design solutions from die to package, board, connector, or cable. This team brings a total of 175 years of signal integrity experience and capabilities directly to customer engineers, including the IC optimization package, complete system design, signal and power integrity analysis, advanced package engineering, and in-depth signal integrity training.
With 28 Gbps systems becoming the norm in mainstream markets, and 40 and 56 Gbps speeds on the horizon, the need to develop solutions that support both high density and signal integrity performance at these speeds is becoming increasingly critical. At these extreme speeds, Teraspeed® Consulting can guide clients through their complete product design, taking the concept of signal integrity optimization beyond the connector and into the entire system.
