Board-to-board solutions include angled and coplanar configurations for board edges (HSEC8 series) and the reinforced EdgeRate™ two-piece connector system (ERM8/ERF8 series). High-density solutions are possible with SEARAY™ arrays (SEAM/SEAF series), while Q2™ connectors with integrated ground plane target traditional power and ground applications within high-speed interconnects.
Creative I/O solutions for increasing panel density and flex jumper solutions are also showcased.

 

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