With its FlexFusion ™ Direct to Chip liquid cooling solutions , Panduit offers an integrated system specifically designed to meet these requirements, enabling efficient, compact, and scalable heat dissipation directly at the point of origin.
Modern AI servers generate high thermal loads directly on the processors. Direct-to-Chip (DTC) cooling dissipates this heat directly from the chip, reducing reliance on space- or rack-based air cooling. This helps data center operators achieve ever-increasing rack densities within existing footprints while ensuring thermal stability.
The Panduit Direct to Chip cooling system consists of FlexFusion DTC cooling racks and rack manifolds (German: Verteiler) made of AISI 304 (V2A stainless steel), developed as coordinated system components. The racks feature adjustable E-rails, double-leaf doors, and a steel frame and door with an electrically conductive connection. They utilize previously unused space inside the rack, eliminating the need for additional side-by-side cabinets or rear extensions. This simplifies planning and reduces potential installation errors when integrating liquid-cooled servers.
The FlexFusion DTC rack manifolds, with a maximum inlet pressure of 150 psi (10.34 bar), deliver coolant evenly to the liquid-cooled servers. The heated liquid (recommended: water with 25% propylene glycol) is then reliably returned to the cooling distribution unit (CDU) via 36 distribution couplings. Leak-free quick couplings, automatic purge valves, and flexible mounting options facilitate fast and reproducible installation, as well as low-maintenance operation in high-density data center environments.
Panduit's Direct to Chip solutions are part of a broad range of cooling products and complement existing concepts such as Rear Door Heat Exchangers (RDHx). This allows operators to implement hybrid cooling architectures that account for both air-cooled and liquid-cooled systems within a data center and can be scaled up to meet increasing performance requirements.
Panduit's FlexFusion Direct to Chip cooling solutions are designed for use in AI and HPC clusters, enterprise and colocation data centers, as well as edge and on-premises deployments, helping operators consistently address the thermal, spatial, and infrastructure challenges of modern IT environments.
