These liquid cooling technologies support the growing demands of AI and next-generation high-density computing to help customers deploy high-density infrastructure faster and operate more efficiently.
The Vertiv CoolChip family is a fundamental component of Vertiv's thermal chain, a comprehensive portfolio that includes direct chip cooling, immersion cooling, backdoor heat exchangers, coolant distribution, heat dissipation, intelligent controls, and lifecycle services in a single cohesive thermal management system.
The newly announced solutions will be showcased at the Datacloud Global Congress in Cannes (June 1-4), where Vertiv will participate as a Patron sponsor and present its latest technologies at booth #123.
“The rapid growth of AI workloads is driving a fundamental shift in how data centers are designed, cooled, powered, and operated,” said Paul Ryan, president for EMEA at Vertiv. “At Datacloud Global Congress, we showcased how Vertiv is expanding its comprehensive portfolio, combining high-density power solutions, liquid cooling, heat dissipation, intelligent controls, and lifecycle services to help customers deploy AI-ready infrastructure faster and operate more efficiently over time.”.
As a critical link within the Vertiv™ thermal chain, the Vertiv CoolChip CDU 2300 is a liquid-to-liquid refrigerant distribution unit that delivers 2.3 MW of cooling capacity in a compact footprint, offering one of the highest capacity-to-area ratios available on the market. Its smaller cabinet size allows for flexible placement, including in rows or adjacent mechanical areas, helping operators reduce floor space requirements and the number of CDUs needed in high-density, large-scale deployments.
Vertiv™ CoolChip CDU systems range from 100 kW to 2.3 MW and support direct-to-chip liquid cooling as well as rear-door heat exchangers. The integrated Vertiv™ CoolChip CDU controller adapts temperature and flow to workload demands, while features such as redundancy, inter-unit communication, and remote monitoring help improve system availability and simplify operations. This controller-level intelligence allows the CDU to operate in coordination with other elements of the thermal chain, enabling consistent thermal performance across the entire infrastructure.
Complementing the CDU within the thermal chain architecture, the new Vertiv™ CoolChip Fluid Network Row Manifolds provide the physical connectivity layer between coolant distribution units, server-level cooling hardware, and heat dissipation systems. Each manifold assembly undergoes cleaning, passivation, pressure testing, and sealing to ensure superior cleanliness, corrosion resistance, and leak-free operation. The configurable design provides full system compatibility with direct-to-chip cooling, immersion cooling, and rear-door heat exchangers, while simplifying coolant routing. It also enables rapid deployment for new builds or retrofits, helping operators scale their liquid cooling infrastructure in weeks rather than months
Vertiv complements its portfolio with Vertiv™ Liquid Cooling Services, which encompass design, installation, and ongoing maintenance support. This lifecycle approach is designed to help customers maximize efficiency, maintain system availability, and support consistent performance as liquid cooling becomes an integral part of modern data center operations.
Vertiv experts will be available throughout Datacloud Global Congress at booth #123 to discuss Vertiv's comprehensive portfolio of power, cooling, and converged infrastructure solutions designed to support AI-ready, high-density data centers. Explore information and resources at Vertiv.com/AI
