Compatible with OCP Rev. 2.0 (UQD/UQDB 2.0)
The flagship UQD and UQDB connectors in the liquid cooling series have been optimized to fully comply with the Open Compute Project (OCP) Rev. 2.0 specifications. The UQD series offers quick-connect technology, while the UQDB features blind coupling for easy installation. Improvements in each series include fully defined geometry compliant with OCP Rev. 2.0 and optimized flow performance. A hybrid configuration, allowing a UQD connector to be coupled to a UQDB socket, has also been developed in the latest OCP Rev. 2.0 specification.

High Flow, Low Resistance Supply Line (SHQD Supply Line):
With a flow rate performance of up to 800 l/min, the Semi-Manual Coupling Self Sealing Connector (SHQD) incorporates a double-locking safety mechanism and large-diameter valve designs of 1", 1.5", or 2". This supply line connector facilitates full-flow, low-resistance liquid cooling between a Refrigerant Distribution Unit (CDU) and a manifold (distribution piping), ensuring reliable operation and minimizing pressure drop in high-flow supply line applications.

Compact, Reliable Connections (MQD/OMQD):
The Multi Quick Disconnect Connector (MQD) incorporates a push-pull locking mechanism in a compact design to deliver high performance and reliability in compact computer tray environments. Essential to enabling the next generation of liquid cooling systems, the MQD is available in sizes 02, 03, and 04, all with a straight and a right-angle version. 90° for flexible installation and ease of use.

The customizable Optical Module Quick Disconnect (OMQD) connector, designed specifically for these applications, is compatible with cooling systems handling data rates of 1.6 T and 3.2 T. Available in ultra-compact fluid diameters of 1 mm, 2 mm, or 3 mm, the OMQD can be hand-mounted—with an included locking mechanism—or blind-mounted with an optional floating feature. Contact Amphenol Industrial Operations for available options and delivery terms.



data center liquid cooling connectorRobust Multichannel Manifold:
The new manifold from Amphenol Industrial Operations, which reliably distributes refrigerant through a multichannel network, provides the necessary infrastructure for optimal cooling throughout the system. Constructed from durable materials such as stainless steel, copper, aluminum, or robust plastics, the manifold promotes corrosion resistance while facilitating thermal management to reduce the risk of overheating and energy consumption. We offer custom manifolds with short lead times for rapid installation in a wide range of applications, from high-performance data systems to electric vehicles and industrial machinery.

The Foundation of Next-Generation Performance:
Thanks to the addition of a double safety interlock via a bidirectional ball valve and a dry-cut system, the expanded series of connectors provides greater protection against leaks during maintenance and service, as well as preventing the valve from opening when not engaged. Aerospace-grade sealing enhances safety and reliability, while low flow resistance increases connector performance.

The new connectors are supplied with various termination options, including threaded, hose barb, and sanitary flange, with customization available upon request. The outer housings are made of corrosion-resistant stainless steel. EPDM rubber gaskets, providing chemical and thermal resistance against a range of glycol-based coolants, are offered as standard, with additional gasket options available depending on the coolant or system fluid.


Ty Yesensky, senior product manager for the Americas at Amphenol Industrial Operations, noted: “Data is transmitted at high speeds through high-performance AI data centers and other power-hungry environments around the clock. These systems require integrated liquid cooling methods that can handle the consistently high levels of heat generated. Our expanded series ensures reliable connectivity, minimal pressure drop, and consistent integrity for virtually any high-performance, liquid-cooled environment.”

More information