Designed in accordance with The Open Group’s Sensor Open Systems Architecture™ (SOSA) technical standard and compliant with VITA 91 requirements, the MIL-HD2 series delivers industry-leading density and performance for 3U applications. With data rates up to 56 Gb/s PAM4, this connector family enables system architects to meet increasing bandwidth demands while maintaining compatibility with commercial off-the-shelf (COTS) architectures and avoiding costly redesign cycles.
The MIL-HD2 series was developed to support next-generation switch and payload card designs, where narrower card pitches and smaller chassis are critical. Available in 3, 4, and 6-pair configurations, it offers the highest number of differential pairs currently available in a 3U form factor at 56 Gb/s PAM4 speeds.
Designed to ensure high-speed signal integrity, the MIL-HD2 series incorporates patented crosstalk reduction technologies, improved impedance matching, and proven EMI performance. Its compact 1.80 mm pitch allows for exceptional density, supporting between 28 and 84 differential pairs per inch. The design also features a 15.7 mil drill-compatible pin that allows for deeper back-drilling, further enhancing high-speed performance in advanced system designs.
Mechanical and reliability improvements include shielded contacts that mate before the signal contacts, providing up to 4 mm of contact area for enhanced connection integrity and hot-swapping compatibility in mission-critical environments. Additional flexibility is provided through integrated capacitor options and optimized footprints, allowing designers to tailor solutions to specific application requirements.
