New system architectures with multiple chip-to-chip connection schemes will be required to achieve data rates of up to 224 Gbps-PAM4, representing a significant, yet complex, technological inflection point. The complete portfolio of solutions includes:
• Mirror Mezz™ Enhanced—an addition to the Mirror Mezz family of hermaphrodite mezzanine-type board-to-board connectors, this product supports speeds of 224 Gbps-PAM4 and a variety of printed circuit board (PCB) height requirements and space limitations, as well as manufacturing and assembly challenges.
Mirror Mezz Enhanced expands the capabilities of Mirror Mezz and Mirror Mezz Pro, which were selected as the standard for the Open Control Module (OCM) by the Open Accelerator Infrastructure Group, a subgroup of the Open Compute Project (OCP)
• Inception™—Molex’s first hermaphrodite backplane connector system designed from a “wire-first” perspective, offering greater application flexibility from the outset and featuring variable pitch densities, optimal signal integrity, and simplified integration with multiple system architectures. Simplified surface-mount technology (SMT) reduces the need for complex board drilling and via processing at the PCB interface. Multiple wire gauge options can be matched with custom lengths, both internally and externally to the application, for optimized channel performance.
• CX2 Dual Speed—Molex’s 224 Gbps-PAM4 near-ASIC connector-to-wire system offers robust and reliable operation with the advantages of screw-lock after mating, integrated strain relief, reliable mechanical sliding, and a fully shielded “thumb-proof” interface to ensure long-term reliability. High-performance twin-conductor (twinaxial) high-performance shielding and an innovative shielding structure provide superior Tx/Rx (transmit/receive) isolation.
• OSFP 1600 Solutions—These I/O products include SMT connectors and cages, BiPass/Flyover, along with DAC (Direct Attach) and AEC (Active Electrical Cable) solutions built for 224 Gbps-PAM4 per lane or an aggregate speed of 1.6T per connector. Enhanced shielding minimizes crosstalk and increases signal integrity at a higher Nyquist frequency.
• QSFP 800 and QSFP-DD 1600 Solutions—This product line has also been enhanced to provide SMT connector and cage, BiPass/Flyover, along with DAC and AEC solutions built for 224 Gbps-PAM4 per lane or an aggregate speed of 1.6T per connector.
