These new high-density connectors are designed for complex, high-speed, board-to-board connections in telecommunications and data transmission devices.
The modular, shielded connectors are available with seven rows of 91 or 133 contacts and a 5 mm stacking height for a mated connector pair. The connectors operate over a wide temperature range (-55 °C to +125 °C). The signal contacts feature SMT termination, and two termination options are available for the surrounding shielding, depending on the application: SMT or Through Hole Reflow (THR) for reinforced boards or added mechanical protection against pulling. SMT signal coplanarity is guaranteed to be less than 0.10 mm on all contacts. The 1.0 mm signal pin pitch and 1.5 mm cross pitch allow for horizontal or vertical configuration of differential or single-terminated signals to meet specific impedance requirements.
The MicroSpeed modular connector system is the ideal solution for next-generation systems with transfer speeds up to 10 Gbit/s. Various signal-pair configurations are possible for differential data transmission. Parallel signal connections are recommended to improve crosstalk properties. SPICE models and evaluation boards are available to support high-speed designs.
New 7-row female and male vertical connectors expand the MicroSpeed family, which includes 2-row connectors offered with various board-to-board stacking heights from 5 mm to 20 mm in 1 mm increments. For rugged applications, MicroSpeed Blind Mate connectors are available, manufactured from a UL94 V-0 LCP-grade, high-impact thermoplastic and designed with thicker housing sidewalls. The housing provides two polarized guide elements to assist with alignment and secure mating. ERNI also offers a full range of power modules with stacking heights from 5mm to 20mm and S connectors. They come equipped with black insulating bodies to ensure quick and reliable visual recognition, and a pre-mounted pick-and-place cover for easy PCB mounting.
