The ZipLine connector system already provided support for motherboards and midplane orthogonal applications, but system designers also saw a need for high-density, high-speed connections to coplanar add-in cards used for system upgrades, memory expansion, and testing. By adding support for coplanar applications, FCI continues to expand its product range in response to the diverse needs of its customers.
ZipLine connectors are the highest density, press-fit connectors available and meet the need for increased signal density in next-generation equipment platforms. The connectors provide six high-speed differential signal pairs per column with a 1.8 mm pitch, carrying 84.6 differential pairs per inch of card edge. The compact module size allows for a minimum 1-inch card slot pitch, and system designers have taken mechanical and thermal considerations into account.
ZipLine connectors utilize FCI's proven "shield-less" technology to deliver low insertion loss and crosstalk without the need for costly and space-consuming metal shields. Data rates can scale up to 12.5 Gb/s without requiring a base platform upgrade.
Furthermore, to provide superior signal density and optimal electrical performance, ZipLine's versatile design allows for mixed, single-ended, or power pin differential assignments within one connector.
ZipLine's connector system has been selected as a finalist for DesignVision 2009 in the Interconnection Technologies and Components category. The winner will be announced at the upcoming DesignCon exhibition on February 3-4, 2010, in Santa Clara, California.