Engineering teams validated the first staggered circuit layout, which positions the pins in four rows with a signal contact pitch of 0.175 mm. The Quad-Row board-to-board connectors have a current rating of 3.0 A and meet high-power customer requirements in a compact form factor. Furthermore, the product conforms to a standard solder pitch of 0.35 mm to accelerate volume manufacturing using typical surface mount technology (SMT) processes. Reliable and robust performance is ensured by insert-molded internal shielding studs, which protect the pins from damage during volume manufacturing and assembly.
The connectors are also suitable for larger coil sizes, which can facilitate production efficiencies and improve production throughput rates. Molex Quad-Row board-to-board connectors are available worldwide in 32- and 36-pin configurations and soon in 20- and 64-pin configurations. Configurations up to 100 pins are planned.
