Pending approval by the IEC and ANSI/EIA, Molex aims to establish an open industry standard for connectors to increase their adoption across various platforms and by a multitude of manufacturers.
Designed for factory automation applications requiring up to 630 V and 16.0 A—three times the power handling of standard M12 connectors—Brad M12 power connectors accommodate wire sizes commonly found in power applications. These connectors feature the industry's most robust mating and polarization system for enhanced performance and improved blind connections; covered electrical contacts to protect fingers; and are available in 4-pin configurations as well as 4-pin plus a PE (Protective Earth) grounding pin. The IP67-compliant interface ensures a sealed connection and is ideal for industrial environments characterized by harsh conditions and humidity.
The Brad M12 power connection system is available in AC (630 V, 12.0 A, 2 to 4 pins plus PE pin) and DC (63 V, 16.0 A, 2 to 4 pins with optional PE pin) versions. The AC version consists of 630 V power circuits (2ΦY (120/208 V), 3ΦY (277/480 V), and 3ΦD (120/208/240 V)) with pins for L1, L2, L3, N, and PE, while the 63 V DC version includes up to two DC power circuits (2 x V-/2 x V+) or one DC circuit plus a PE pin.
The robust mating system of the Brad M12 power connectors dramatically reduces the possibility of incorrect connections and allows for blind mating to facilitate connections in low-visibility installation areas. The pins are covered by a contact plate, which protects fingers and eliminates the possibility of electric shock from exposed pins. For added system safety, the center PE pin (CA version) or optional pin (CC version) offers FMLB (first-mate-last-break) protection, meaning it is the first to connect and the last to disconnect.
Han® Q 4/0 and Han® Q 3/0 power connectors in the semiconductor industry
In the semiconductor industry, microchips are manufactured from what are known as wafers, which are composed of a high-purity crystalline material such as silicon. The wafers are initially polished and cleaned before undergoing various surface treatments, including oxidation and CVD.
