The module series is suitable for low-cost Wi-Fi 6 applications requiring low data rates, for example, inverters, medical devices, heat pumps, or electric vehicle chargers.
The devices CC3301 and CC3351 TI's chipsets are particularly noteworthy for their compatibility with Wi-Fi 6 and Bluetooth LE 5.4 at an affordable price. They feature robust security, including WPA3 and firmware authentication capabilities. The versatile architecture of these chipsets allows for seamless integration with processors running Linux/Android or microcontrollers (MCUs) capable of running RTOS and network stacks, enabling them to address a wide range of industrial and Internet of Things (IoT) applications requiring affordable, secure, and reliable wireless communication.
Tomislav Tipura, Product Manager at Panasonic Industry, commented, “We are proud to continue our decade-long collaboration with Texas Instruments and are excited to introduce this new series of modules, built on their advanced CC3301 and CC3351 chipsets. This collaboration allows us to offer high-performance solutions that meet our customers’ evolving needs at a competitive price.
” Shmulik Elgavi, Product Line Manager for Wi-Fi 6 Connectivity Solutions at Texas Instruments, added, “In today’s fast-paced IoT landscape, companies designing innovative Wi-Fi 6-compatible applications are focused on reducing time to market for new products while keeping costs down. Panasonic’s W602 PAN module family, based on our SimpleLink wireless products, is helping to meet this need and expand the capabilities of Wi-Fi and cloud-based ecosystems. We expect these modules to continue unlocking the potential of our increasingly connected world. ”
The PAN W602 series Wi-Fi 6 and Bluetooth module will be certified by CE RED, FCC, ISED, MIC, and NZ/AUS. Samples are already available, and mass production is scheduled to begin by the end of 2025.
