They target most wireless telecommunications applications required for the new generation of compact infrastructure equipment in addition to base stations or handheld devices.
The new SMP-MAX misalignment solution includes a patented impedance isolator, optimized for a larger operating gap between connectors, making it easier for engineers to manage the maximum board-to-board tolerance distance of up to 0.78” (2mm) without jump, which is 300 percent more than the SMP standard. It also features 3 degrees of radial travel and an operating frequency range of DC-6 GHz, a guaranteed maximum VSWR of 1.2 up to 3 GHz, and can handle up to 165 watts of power at 3 GHz.
Radiall’s IMP-Spring, SMP-Spring, and MMBX-Spring are spring-loaded solutions ideal for both increasing board-to-board misalignment distances with a tolerance of up to 0.78” (2mm) and providing radial travel of up to 4.5 degrees. Furthermore, these solutions have a consistently low VSWR, from 1.15 to 3 GHz, and low RF leakage.
