Applications include corporate network towers, telecommunications hubs and servers, industrial controllers, and high-capacity scanners for medical, aerospace, and military purposes.
Equipped with two vertical connectors, one male and one female, the NeoScale high-speed mezzanine system features a patented modular design based on wafer triads, enabling customized PCB routing in high-density applications. The system's also patented Solder Charge Technology™ method for securing PCBs is characterized by its robust solder joints. Designers can choose between 85 Ω and 100 Ω resistors, power triads, and low-speed signals to create a mezzanine solution tailored to their needs. Robust triad-based blind-mating connections for multiple connectors are also available.
“The NeoScale high-speed mezzanine system uses differential pair triads, protected with specific grounding, to provide exceptionally clean signal transmission compared to other mezzanine connectors,” says Nadine Dytko-Madsen, product manager for the global market at Molex, adding: “System architects and hardware engineers can rely on a dependable and customizable design tool for their high-density systems.”
The NeoScale wafer triad module consists of three pins per differential pair: two signal pins and one protection pin. Each triad is an independent, protected differential pair with a capacity of 56 Gbps or an 8 A power supply. The triads can be optimized for signals with support for high-speed 85 Ω or 100 Ω differential pairs, high-speed unipolar transmissions, low-speed unipolar control signals, and power pins.
“The NeoScale high-speed mezzanine system is fully customizable, so designers can adapt it to their needs,” explains Nadine Dytko-Madsen, adding: “And above all, it can effectively replace four connectors, thus providing considerable space savings on the PCB.”
Other mezzanine options include high-speed differential pairs from 90 Ω to 92 Ω to accommodate impedances from 85 Ω to 100 Ω, or options with only 85 Ω or 100 Ω. The NeoScale high-speed mezzanine system allows designers to transfer signals at high speeds and impedances of 85 Ω and 100 Ω through a single connector. Additionally, low-speed unipolar signals (three signals per triad) and a power supply (8 A per triad) can be used.
The system's honeycomb housing features optimized routing in each triad, minimizing interference and allowing for efficient PCB output across one or two layers, thus saving board space. Furthermore, the housing's unique "strength pillar" structure protects the mating interface and flexible contacts from damage to the terminals.
The NeoScale high-speed mezzanine system is available in stacking heights from 12.00 mm to 42.00 mm and circuit sizes from 8 to 300 wafer triads in 2, 4, 6, 8, and 10-row configurations and impedances from 85 Ω to 100 Ω, enabling optimal design flexibility. Custom versions are also available, such as stacking heights from 10.00 mm to 45.00 mm.
