The miniature MicroPOD™ parallel embedded optical transmitter and receiver modules achieve lane speeds of up to 12.5 Gbps for a combined bandwidth of up to 150 Gbps. These modules enable higher-density interconnect solutions than previously available with other pluggable optical or electrical interconnect solutions, whether embedded or board-edge mounted.
Avago's compact transceiver modules are expected to pave the way for the development of the next generation of supercomputers, network switches, and routers used in data centers, as well as in science, research, and entertainment. Versatile design solutions are possible because the MicroPOD modules achieve data transmission speeds of 1 to 12.5 Gbps while meeting IBTA 12xQDR Infiniband and IEEE 802.3ba 100GBASE-SR10 specifications.
The formats that have traditionally dominated embedded computing have been SNAP12 and POP4, with speeds up to 3.125 Gbps per lane. The next generation of computing, switching, and routing systems will require terabytes of interconnection between nodes. Avago's new MicoPOD modules, designed to meet this market need, offer unprecedented density to expand bandwidth capacity up to 12.5 Gbps per lane in a very compact form factor. Measuring just 7.8 mm x 8.2 mm x 3.9 mm, these modules incorporate Avago's VCSEL and PIN configuration technologies, as well as its IC technologies, to optimize the modules and achieve superior electrical signal integrity along with high optical performance. Signal integrity is further enhanced by the use of a micro LGA electrical interface to the main board.
The US Conec PRIZM™ LightTurn® miniature detachable connector, specially developed for Avago's MicroPOD receiver and transmitter modules, provides passive optical connectivity and enables dense module placement on the main printed circuit board. Using the PRIZM LightTurn connector and the US Conec MTP® brand MPO-type connector significantly increases port density at the board edge compared to edge-mounted plug-in solutions. This US Conec solution allows for simple, low-cost termination that eliminates the need for fiber polishing and is easy to test, while also providing excellent mating with Avago modules.
