This ultra-efficient transmitter contains a high-performance 870 nm chip and features an array of micro-optical elements that gather and focus emitted photons, coupling significantly more light onto multimode optical fibers and enabling data to be reliably transmitted over greater distances, or for the system to use less energy to achieve the same result. Increased long-term system reliability is an added benefit due to the vastly improved day-one launch power and much lower drive current requirements.

The new FDE870HE device is optimized for use with small-core, multimode glass optical fibers in industrial systems. It boasts exceptionally high coupled power and is available in a variety of housings (including SMA and ST interfaces) with its optical performance configured for different fiber core sizes, including 50/125, 62.5/125, 100/140, and 200/230 – according to customer requirements. With 50 µm fiber, at the nominal excitation current of 50 mA, it achieves a typical coupled power of 60 µW. This compares to approximately 30 µW at 100 mA for existing transmitters on the market: twice the launch power for half the current, or four times the efficiency. For other core sizes, the launch power at a drive current of 50 mA is approximately 1050 µW for 200 µm fiber, 260 µW for 100 µm fiber, and 110 µW for 62.5 µm fiber. The device's maximum rise and fall times at 50 mA are 10 ns, making it suitable for high-speed industrial data transmission.

To take full advantage of the device's optical characteristics, precise alignment of the emitter with the fiber optic interface is required when mounting the LED in a fiber optic housing. To achieve this, OMC uses its patented active alignment technology, which helps ensure that each fiber optic data link performs consistently throughout its often very long lifespan. This overcomes the problem of relying solely on mechanical adjustment of the LED within the housing for alignment and eliminates any variability caused by tolerances in, for example, the position of the LED chip within the lead frame, which can otherwise lead to inconsistent results from device to device.

OMC's active alignment techniques involve powering up the transmitter during the manufacturing process and optimizing the LED position so that the amount of light falling on the fiber face, within the angular limits of its acceptance cone, is within the precisely defined performance window required for each application. OMC also uses the same process when manufacturing hosted receiver devices, resulting in a highly consistent optical link. Through this patented process, much tighter levels of control and much narrower performance windows can be achieved for each element of the link than would otherwise be possible, saving customers significant costs by improving performance and ensuring consistent reliability.

The first PCB-mount housing variant of this transmitter offered by OMC, the H22DBE870HE, is now in full production and features a precision-machined all-metal housing with SMA interface, locking nut, and heavy-duty screw-mount mechanical connection for the circuit board.

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