Leveraging our patented L-PIC, the MAOT-025402 is designed to mate with the CDR MASC-37053A to form a complete high-speed transmission path for CWDM4 QSFP28 solutions. MACOM's MAOT-025402 CWDM4 L-PIC solution was showcased at OFC 2018, Booth #2613.
As explosive data traffic growth and insatiable demand force cloud data centers to rapidly scale their capabilities, MACOM is poised to lead the transition from 100Gbps to 400Gbps and from 4G to 5G with a cost-effective, high-performance, and highly integrated interconnect chipset solution for CWDM4, scalable for FR4 and FR1/DR1 applications.
The core of the MAOT-025402 is the MAOP-L284CN L-PIC device, which integrates four high-performance 25 Gbps CWDM wavelengths onto a single silicon photonic integrated circuit (PIC) to deliver 100 Gbps single-mode duplex fiber communication. MACOM's L-PIC platform provides a highly integrated silicon photonic solution for specific data center applications, including four CW lasers, monitor photodiodes, high-bandwidth waveguides, modulators, and multiplexers. Utilizing MACOM's proprietary SAEFT (Self Aligning Etched Facet Technology) for precise laser etching to the silicon chip, the L-PIC platform eliminates the need for active laser alignment, offering significant cost savings for the customer and enabling core deployment.
"MACOM is leveraging our L-PIC platforms to enable industry-leading scalability to meet the rapidly growing demand for the CWDM4 module," said Vivek Rajgarhia, Senior Vice President and General Manager of Lightwave at MACOM. "The platform's automatic self-alignment calibration and firmware control are expected to provide the necessary combination of scale and cost for mainstream cloud data center deployments.".
MACOM's L-PIC platform offers critical bandwidth to enable CWDM4 and is now available in TOSA and die formats. Each L-PIC product includes a complementary controller and PIC driver. By leveraging this three-device chipset, customers can significantly reduce engineering risk and achieve faster time to market. The accompanying software provides automated calibration and self-test capabilities, significantly reducing the capital investment required for production lines. Fully integrated and pre-assembled, MACOM's sub-assembly platform is expected to deliver the high performance required to achieve 100Gbps and 400Gbps data center links while reducing transceiver manufacturers' engineering and capital equipment costs, enabling faster time to market with less investment.
