As AI workloads continue to push the boundaries of computing performance, data centers face increasing pressure to manage heat efficiently. The DTC cooling system addresses this challenge head-on, offering a future-proof solution that aligns with sustainability and operational efficiency goals.
“Our DTC cooling system reflects Panduit’s commitment to solving real-world infrastructure challenges with smart, scalable solutions,” said David Weksel, director of strategic growth at Panduit Ventures. “This launch represents a significant step forward in creating AI-ready environments that are efficient, reliable, and future-proof.”
Designed for high-density computing,
the DTC cooling system includes FlexFusion™ cabinets and rack manifolds that work together to provide consistent, leak-free liquid cooling directly to the chip. Key features include:
Movable electronic rails and split-hinged doors for simplified expansion;
electrically bonded steel frames for structural integrity;
quick-connect manifolds with automatic air exhaust valves for fast, error-free installation; and
standard cabinet footprint—no rear extensions or modifications required.
This design allows data center operators to deploy high-density AI servers without compromising space, speed, or reliability.
Part of a comprehensive range of cooling products,
the DTC cooling system complements Panduit’s existing line of rear-door heat exchangers (RDHx), creating a complete liquid cooling strategy for modern data centers. Together, these solutions support scalable infrastructure in AI, HPC, and edge computing environments.
Availability
The direct chip cooling system is now available in the United States.
