The system is now available in Europe, the Middle East, and Africa (EMEA).
Immersion cooling submerges entire servers in a dielectric fluid, providing efficient and uniform heat removal across all components, especially in environments where power density and thermal loads exceed the limits of traditional air-cooling methods. Vertiv CoolCenter Immersion acts as a complete liquid cooling architecture, enabling reliable heat dissipation for high-density compute systems ranging from 25 kW to 240 kW per system.
“Immersion cooling is becoming increasingly important as AI and HPC deployments push thermal limits far beyond what conventional systems can handle,” said Sam Bainborough, Vice President of Cooling Business for EMEA at Vertiv. “With Vertiv CoolCenter Immersion, we’ve applied decades of liquid cooling expertise to deliver fully engineered systems that safely and efficiently manage extreme thermal densities, providing operators with a practical way to scale their AI infrastructure without compromising reliability or maintainability.”
Vertiv CoolCenter Immersion is available in multiple configurations, including standalone and multi-tank options, with cooling capacities ranging from 25 kW to 240 kW. Each system includes an internal or external tank, refrigerant distribution unit (CDU), temperature sensors, variable-speed pumps, and fluid piping, ensuring precise thermal control and stable performance. Dual power supplies and redundant pumps guarantee high cooling availability, while integrated monitoring sensors, a 9-inch touchscreen, and connectivity with building management systems (BMS) simplify system operation and visibility. The system design also facilitates heat reuse opportunities, supporting more efficient thermal management strategies aligned with global energy efficiency goals.
The Vertiv™ Liquid Cooling Services portfolio offers comprehensive end-to-end support—from design and installation to maintenance, training, and lifecycle optimization—helping customers evaluate and deploy the most suitable liquid cooling architectures. Supported solutions include rear-door heat exchangers, direct-to-chip liquid cooling, and immersion cooling, providing reliable, scalable, and efficient thermal management for AI, HPC, and high-density computing environments.
