These new products are ideal for Internet of Things applications and Bluetooth beacons, and make it easier for designers to take advantage of the low power consumption and simplicity of Bluetooth LE connectivity.
Among Microchip's new Bluetooth LE devices is an integrated and certified Bluetooth 4.2 firmware stack. Developers can expect data transfer speeds up to 2.5 times faster, as well as enhanced connection security with support for a FIPS-based secure connection. Data is sent and received over the Bluetooth link using transparent UART mode, making it easy to integrate with any processor or one of the hundreds of Microchip PIC® microcontrollers that have a UART interface. The module can also operate independently without a host in beacon applications.
The optimized power consumption profile of these new devices minimizes current draw to extend battery life, while their compact form factors—starting at 4x4 mm for the RF ICs and 15x12 mm for the module—reduce the space they occupy on the board. Module options include RF certifications, as well as uncertified modules (unshielded/without antenna) for smaller designs and more remote antennas, which are certified for emissions as a final product.
Microchip's Bluetooth LE modules include all the hardware, software, and certifications designers need. Developers can leverage Microchip's Qualified Design ID (QDID) for Bluetooth to easily list their products on the Bluetooth SIG. Embedded Bluetooth stack profiles include GAP, GATT, ATT, SMP, and L2CAP, as well as proprietary transparent UART services. All modules are configurable using tools based on Microchip's Windows® operating system.
Microchip also announced the BM70 Bluetooth Low Energy PICtail™/PICtail Plus daughterboard. This new tool allows for code development via a USB interface to a PC, or by connecting to one of Microchip's existing microcontroller development boards, such as the Explorer 16, PIC18 Explorer, and the PIC32 I/O Expansion Board. The BM-70-PICTAIL is available now and is priced at $89.99 per unit.
The IS1870 RF IC for Bluetooth LE is now available in a 6x6 mm, 48-pin QFN package, while the IS1871 is expected in November and will be supplied in a 4x4 mm, 32-pin QFN package. The 30-pin BM70 modules for Bluetooth LE are already available, with or without an on-board antenna.
