Background to Development:
LD chip manufacturers and optical equipment suppliers evaluate the optical spectrum of LD chips during manufacturing. Demand for high-power LD chips is driven by higher communication bit rates and greater LiDAR detection ranges. Furthermore, new application cases, such as ELSFP (External Laser Small Pluggable) modules for co-packaged optical applications, are expected to accelerate demand. The continuous wave (CW) output of a high-power LD chip suffers from power deviation and wavelength shift as the chip temperature increases. This is mitigated by suppressing the temperature rise through the use of pulsed LD chips. However, current testing of pulsed LD chips during production is more time-consuming because an external trigger signal is required to synchronize with the pulsed LD chip.
Robust design for any environment
- Reduced test time for pulsed LD chips.
The new MS97040B-020 solution accelerates optical spectrum evaluation by eliminating the need for a trigger signal.
- Guaranteed measurement reproducibility even for high-power LD chips.
This solution guarantees measurement reproducibility of ±1.4 dB* for the side mode suppression ratio (SMSR). Low SMSR variation improves the performance of LD chips and contributes to production efficiency.
*±1.8 dB with MS9740B-020 installed.
