Cinch CIN::APSE custom interconnects are designed for board-to-board, IC-to-board, flex-to-board, and component-to-board connections in digital, flex-to-board, and high-speed PCB applications. A wide range of profiles from 0.020" to 1.0" and contacts from 0.5 mm to 1.0 mm in diameter are available, with a standard pitch of 1.0 mm or greater. The number of contacts is unlimited, and the largest connector implemented to date contained 7,396 I/O points.
The patented design uses liquid crystal polymer insulators and gold-plated molybdenum wire contacts, enabling speeds exceeding 50 Gbps. Solderless termination is achieved through compression, and the unique contact design ensures multiple contact points per I/O. Gold-plated copper spacers are used for the long Z-axis connectors.
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